3225mm,FMI無線通信晶振,FMXMC2S118HJB-40.000000M-CM,FMXMC2S系列,歐美進(jìn)口晶振,FMI水晶振動(dòng)子,四腳貼片晶振,無源諧振器,石英水晶振子,超薄型晶振,SMD晶振,3225mm石英晶振,尺寸3.2x2.5mm,頻率40MHZ,工作溫度-20~+70 °C,無鉛晶振,高可靠晶振,高性能晶振,智能家居晶振,平板電腦晶振,無線設(shè)備晶振,便攜式設(shè)備晶振.
3225mm,FMI無線通信晶振,FMXMC2S118HJB-40.000000M-CM,FMXMC2S系列特點(diǎn):
表面貼裝陶瓷組件。
Micro 3.2x2.5/超薄無源晶振
高可靠性
緊密穩(wěn)定性
3225mm,FMI無線通信晶振,FMXMC2S118HJB-40.000000M-CM,FMXMC2S系列 參數(shù)表
| Parameter | Specification | ||||||||||||||
| Frequency Range | 40 MHz | ||||||||||||||
| Operation Mode | See Operation Mode and ESR Table | ||||||||||||||
| Load Capacitance (CL) | 18 pF Std, 8 - 60 pF and Series available | ||||||||||||||
| Frequency Tolerance | ±30 ppm @ 25°C Std (See Cal. Tol. for Options) | ||||||||||||||
| Temperature Tolerance | ±50 ppm Std(See Temp. Tol. for Options) | ||||||||||||||
| Operating Temperature | -10 to +60°C Std (See Temp. Range for Options) | ||||||||||||||
| Storage Temperature | -40 to +85°C | ||||||||||||||
| Equivalent Series Resistance (ESR) | See Operation Mode and ESR Table | ||||||||||||||
| Shunt Capacitance (C0) | 5 pF max | ||||||||||||||
| Drive Level | 10 µWtypical, 200 µW max | ||||||||||||||
| Aging @ 25°C | ±5 ppm per year max | ||||||||||||||
| Insulation Resistance | 500MΩ min at 100VDC±15V | ||||||||||||||
| Reflow Conditions | +260ºC ±10ºC for 10 sec max 2 reflows max |
3225mm,FMI無線通信晶振,FMXMC2S118HJB-40.000000M-CM,FMXMC2S系列 尺寸圖
西鐵城晶振,32.768K,CM200C晶振,CM200C32768DZCT晶振
TXC晶振,貼片晶振,7M晶振
愛普生晶振,石英晶體振蕩器,VG-4231CE晶振,VG-4231CE 27.0000M-PSCM0晶振
京瓷晶振,CX3225SB諧振器,CX3225SB48000X0WSBCC石英晶體
RH100-25.000-18-F-TR,Raltron微處理器晶體,3225mm,25MHz
FC3VREEGM36.0-T1,FOX進(jìn)口晶振,36MHz,3225mm晶振
FC4SDCBMF12.288-T1,12.288MHz,FOX高質(zhì)量晶振,SMD石英晶體
EC2600TS-66.000M TR,Ecliptek晶振廠家,7050mm,LVCMOS振蕩器
DSC1003CI5-025.0000T,3225mm振蕩器,Microchip移動(dòng)應(yīng)用晶振
